GTI MFG Services

Sourcing Components- At Low Cost. Best Delivery And Highest Quality

All our Suppliers have to pass a rigid qualification process. Therefore you can rest assured that the integrity of components on the boards are always of the highest standard.

Prototype To High Volume Production

We have dedicated “Prototype” lines for the smaller production runs, and we can migrate them to our higher volume assembly lines when the need arises.

Surface Mount Technology (SMT)

SPC (Statistical Process Control) is integrated to our state of art SMT assembly lines to achieve the highest quality and reliability.

Our capabilities are:

AOI (Automated Optical Inspection)
BGA/Micro BGA (Ball Grid Array) assembly and X-Ray inspection
CSP and 0201 component
Fine Pitch and large components

Through Hole Assembly

Whether it is RoHS wave soldering or a secondary hand-soldering operation, our experienced staff will always manufacture to IPC Class II and Class III standards.


We apply aluminum wire bonding on wafer die in a controlled environment clean room. Our intensive testing of the pre/post epoxy processes ensures the product produced is of the highest quality.

Cable Assemblies And Over-Molding Process

We can construct an assortment of cable and wire harnesses, mechanical and sub assemblies, according to your required application and specifications.


We offer the following services:

ICT–In-Circuit Testing
Functional Test
JTAG– Flying Probe
Test Burn-in
Test Vibration Test
System Level Testing

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